+Carton
+ISB
+Peacock
+Sunever
+Teclock
+Well Air
Cleanroom Ball Transfers are used extensively in FPD (Flat Panel Display), PV (Photovoltaic) (LCD, PDP, EL) production lines due to its innovative technology for alignment and positioning of glass substrates all over the world. |
Friction resistance 1/10 compare to conventional Pin alignment. Ball transfer alignment and positioning enables, less friction, long life, stability, compare to Pin which wear soon. With low friction reduce lines, cracks and flaws on glass substrate; improve yields at loader/unloader and other applications. Frequent replacement is not needed which occurs from abrasion or wear. |
Stroke = ±15mm
Ball up
Load Capacity = 150kgf
Positioning stage unit for Glass
substrate cassette buffer.
Variations of materials are available.
Ball up
Large Ball Size
ISC-10 = ø3/8" (9.53mm)
ISC-16 = ø5/8" (15.88mm)
Large Ball Size = ø3/8" (9.53mm)
Ball up
Ball rotation control mechanism,
smooth airflow, prevents turbulences.